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This stealth cutting machine uses dual path ultrafast laser to achieve invisible cutting, which is applied to the processing of ultra-thin silicon wafers and other materials.
This high-end surface mounting machine with advanced dual-arm configurations and high-precision control systems, the machine ensure optimal component placement accuracy, meeting the rigorous demands of modern electronics manufacturing.
High precision machine vision assisted positioning system, effectively improves the production efficiency and product quality
It's a high-speed automatic wire bonder machine, it uses thermal ultrasonic ball welding and wedge welding processes to conduct wire bonding on semiconductor devices by heating, pressurization and ultrasonic energy.
Unit 1009, 10/F, C-Bons Intl. Center, 108 Wai Yip Street, Kwun Tong, Kowloon, Hong Kong
+852-2358-1033
info@googoltech.com
